Mold temperature has a profound impact on release agent adhesion. When mold temperature falls within the optimal range (slightly above the boiling point of water, typically >100°C), moisture in the release agent evaporates rapidly, allowing lubricants to deposit uniformly on the mold surface.
If mold temperature is too low (<100°C): Moisture fails to evaporate in time, causing release agent runoff.
If mold temperature is too high (>260°C): Rapid moisture evaporation triggers the Leidenfrost effect, creating a steam layer that rebounds and prevents release agent droplets from adhering effectively.
Experimental data confirms:
When mold surface temperature exceeds 150°C, release agent deposition amount drops significantly (evaluated via carbon content measurement).
At 250°C, only ~10% of the original deposition remains.
Additionally, high temperatures accelerate release agent decomposition and mold surface oxidation (rusting), further degrading lubrication performance.
Temperature Monitoring: Use an infrared thermal imager to track mold surface temperature in real-time, ensuring it stabilizes between 100–150°C.
Cooling System Adjustment: Regulate overall temperature via internal mold cooling pipes to reduce thermal stress and minimize release agent loss.
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